Structural changes in the Cu-Ni-Si system alloy after ECAP at different temperatures

Authors

  • D. A. Aksenov Institute of Molecule and Crystal Physics UFRC RAS
  • G. I. Raab Nosov Magnitogorsk State Technical University
  • R. N. Asfandiyarov Institute of Molecule and Crystal Physics UFRC RAS
  • La Peiqing Lanzhou University of Technology
  • Zhou Xuyuan Lanzhou University of Technology

DOI:

https://doi.org/10.54708/26587572_2021_3465

Keywords:

Copper alloys; ECAP; electrical conductivity; precipitation hardening; strength. Copper

Abstract

The alloy of the Cu-Ni-Si system has good heat resistance, strength and satisfactory electrical conductivity. Therefore, the The alloy of the Cu-Ni-Si system has good heat resistance, strength and satisfactory electrical conductivity. Therefore, the study of structural and phase changes in this system of alloys under SPD conditions is of particular interest. study of structural and phase changes in this system of alloys under SPD conditions is of particular interest. In this work, we study the effect of room temperature and elevated (300 °C) ECAP temperatures on structural changes In this work, we study the effect of room temperature and elevated (300 °C) ECAP temperatures on structural changes and physical and mechanical properties of the Cu-1.85Ni-0.68Si alloy. It was found that an increase in the temperature and physical and mechanical properties of the Cu-1.85Ni-0.68Si alloy. It was found that an increase in the temperature of deformation processing of this alloy does not lead to qualitative changes in the structure as compared with room of deformation processing of this alloy does not lead to qualitative changes in the structure as compared with room temperature. In both cases, a structure elongated in the direction of shear action is formed with an average grain size temperature. In both cases, a structure elongated in the direction of shear action is formed with an average grain size of 30±2 μm. The nature of post-deformation aging for both ECAP modes also does not change. In this case, a significant of 30±2 μm. The nature of post-deformation aging for both ECAP modes also does not change. In this case, a significant increase in strength by ~290 MPa is observed, which is a significant value for dispersion-hardened copper alloys. The increase in strength by ~290 MPa is observed, which is a significant value for dispersion-hardened copper alloys. The conductivity value for both ECAP modes after aging is 37±2% IACS. It is important to note that ECAP provides a sufficiently conductivity value for both ECAP modes after aging is 37±2% IACS. It is important to note that ECAP provides a sufficiently high plasticity (elongation) of the material –16±1%. Thus, deformation at elevated temperatures will not only reduce the high plasticity (elongation) of the material –16±1%. Thus, deformation at elevated temperatures will not only reduce the load on the tool, but will also allow achieving a high complex of physical and mechanical properties.

Published

2021-30-12

How to Cite

Aksenov Д. А. ., Raab Г. И. ., Asfandiyarov Р. Н. ., Peiqing Л., & Xuyuan . Ч. . (2021). Structural changes in the Cu-Ni-Si system alloy after ECAP at different temperatures . Materials. Technologies. Design., 3(4 (6), 5–10. https://doi.org/10.54708/26587572_2021_3465